1. Cutting and drilling of brittle materials such as glass, sapphire and ceramics.
2. LCD, OLED screen cutting (C, R, U angle cutting).
3. Ultra-precise Mark points on the glass material, fine invisible QR code (0.2mm) and other fine marks.
| Machine model | EP-IRPS-20 |
| Laser wavelength | 1064nm |
| Laser power | 20W / 10ps / 1000kHz |
| Repeated frequency | 1000KHz |
| Marking scope | 100*100mm |
| Marking line width | ≤0.03mm |
| Marking depth | ≤0.1mm |
| Min. character | 0.06mm |
| Marking speed | ≤7000mm/s |
| Repeated accuracy | ±0.01mm |
| [pwer supply | AC 220V, 50Hz, 16A |
| Total power consumption | ≤1.5kW |