1. With 355nm UV laser, the cutting machine has stable performance, good light spot, and long-time stable operation
2. The reliable and high-precision X-Y-Z-θ worktable and excellent accelerating and decelerating performance can efficiently improve the unit time productivity of system
3. Through vacuum absorption, the wafer cannot move during platform moving
4. The wafer can be positioned through positioning the Mark point on the wafer, which can ensure the cutting precision
5. The high-efficient and flexible software operation system has a simple and concise interface
6. Automatic loading and unloading, robot carrying and automatic edge searching function
Specification:
| Machine model |
HDZ-WUVC100 |
HDZ-WUVC200 |
| Laser power |
15W |
15W |
| Laser wavelength |
355nm |
355nm |
| XY axis repeated positioning precision |
±1µm |
±1µm |
| θ axis repeated positioning precision |
±15s |
±15s |
| Cutting line width |
>15µm |
>15µm |
| Cutting depth |
>25µm |
>25µm |
| Cutting speed (*The cutting speed varies from different products) |
100mm/s |
100mm/s |
| Loading and unloading mode |
Manual |
Robot carrying; automatic edge searching |
| Processing product type |
2 inch-12 inch wafers |
2 inch-12 inch wafers |
| Power supply |
AC 220V，50Hz |
AC 220V，50Hz |
